BCM43460KMLG: A Comprehensive Technical Overview of Broadcom's Wi-Fi and Bluetooth Combo Chip

Release date:2025-10-17 Number of clicks:70

BCM43460KMLG: A Comprehensive Technical Overview of Broadcom's Wi-Fi and Bluetooth Combo Chip

The BCM43460KMLG stands as a highly integrated, single-chip solution from Broadcom (now part of Avago Technologies) designed to provide dual-band Wi-Fi and Bluetooth connectivity for a wide array of consumer electronics and embedded systems. This combo chip is particularly renowned for its deployment in numerous high-volume applications, including set-top boxes, smart home devices, and notably, platforms like the Raspberry Pi 3 Model B+, where it delivers robust and reliable wireless performance.

At its core, the BCM43460KMLG is engineered to support dual-band 802.11ac Wi-Fi, operating on both the 2.4 GHz and 5 GHz radio bands. This compliance with the IEEE 802.11a/b/g/n/ac standards ensures backward compatibility with older networks while leveraging the advanced features of Wi-Fi 5 (802.11ac). It achieves a physical layer (PHY) data rate of up to 433 Mbps in the 5 GHz band, facilitating smooth HD video streaming, rapid file transfers, and low-latency online gaming. Key technologies like 2x2 Multiple-Input Multiple-Output (MIMO) with space-time block coding (STBC) and maximal ratio combining (MRC) are employed to enhance signal range, reliability, and overall throughput by using multiple antennas to mitigate the effects of signal fading and interference.

Complementing its Wi-Fi capabilities, the chip integrates a Bluetooth 4.2/5.0 controller with Bluetooth Low Energy (BLE) support. This allows devices to maintain connections with peripherals like keyboards, headphones, and beacons while minimizing power consumption, which is crucial for battery-operated IoT products.

The integration level of the BCM43460KMLG is a significant advantage. It incorporates the radio frequency (RF), baseband processor, MAC, and power amplifiers into a single, compact package. This not only simplifies product design and reduces the bill of materials (BOM) but also minimizes the physical footprint on a PCB. The chip typically interfaces with a host application processor via a high-speed SDIO 3.0 interface for Wi-Fi and a UART/PCM interface for Bluetooth.

From a software perspective, the chip is supported by mature and extensive drivers within the Linux kernel, making it a preferred choice for many embedded Linux projects. Its built-in power management features ensure efficient operation, dynamically adjusting power states to conserve energy during periods of low activity.

ICGOOODFIND: The Broadcom BCM43460KMLG is a testament to highly integrated wireless design, offering a potent combination of high-speed dual-band 802.11ac Wi-Fi and versatile Bluetooth/BLE connectivity in a single chip. Its proven reliability, strong driver support, and comprehensive feature set have solidified its position as a go-to solution for countless consumer and embedded wireless applications.

Keywords: Dual-band 802.11ac Wi-Fi, Bluetooth 5.0, MIMO, Integrated Combo Chip, SDIO Interface.

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